Held from June 4 (Wednesday) to June 6 (Friday), 2025! We plan to showcase new products at the exhibition venue.
Koki Tech Co., Ltd. will be exhibiting at the 'JISSO PROTEC 2025 (26th Assembly Process Technology Exhibition)' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of electronic component assembly technology. Advanced technologies related to electronic component assembly, which are essential for the electronics society, will be gathered in one place. We plan to showcase our all-in-one selective soldering machine model "NEO-L Smart (with IPH)" among others. We understand you are busy, but we kindly ask for your visit. 【Exhibited Equipment】 ■ All-in-one selective soldering machine model "NEO-L Smart (with IPH)" ■ Infrared and hot air circulation reflow oven "VFR-408N" ■ Desktop selective soldering machine "ULTIMA-TRZ" ■ Desktop selective spray machine "ULTIMA-SPZ" ■ Doctor Palette ■ Inline selective soldering machine "SELBO III" *For more details, please download the PDF or feel free to contact us.
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【Exhibition Overview】 ■Exhibition: Electronic Devices 2025 Total Solution Exhibition JISSO PROTEC 2025 (26th Assembly Process Technology Exhibition) ■Date: June 4, 2025 (Wednesday) to June 6, 2025 (Friday) 10:00 AM to 5:00 PM ■Venue: Tokyo Big Sight East Exhibition Hall ■Exhibition Location: East Hall 4, 4D-02 *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
