We provide equipment configurations tailored to our customers' needs based on unique ideas!
At the "KOKI TEC ASIA Exhibition Hall," you can verify soldering quality using reflow soldering, post-process soldering inspection, inline and tabletop selective soldering equipment. We offer operational training, soldering quality improvement, and maintenance (solder pot overhaul) training. Location: 5 minutes by car from BTS Udomsuk Station in Bangkok, located on Udomsuk Soi 31. 【Our Services】 ■ Manufacturing of automatic soldering equipment ■ After-sales service/training ■ Experiments (temperature profiles, soldering quality verification)/training (overhaul procedures, soldering teaching program creation procedures) *For more details, please download the PDF or feel free to contact us.
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【Lineup】 ■ Far-infrared combined N2 atmosphere hot air reflow device: VFR-4010N ■ Inline selective soldering device: SELBOIII-350SHD ■ Desktop selective soldering device & spray fluxer device & preheating heater unit: ULTIMA-TRZ, SPZ, PHS *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."