We are planning to showcase and demonstrate soldering equipment and inspection machines equipped with new construction methods!
Koki Tech Co., Ltd. will be exhibiting at the "40th NEPCON Japan Electronics Development and Manufacturing Expo" held at Tokyo Big Sight. We plan to showcase the 'Soldering Machine SELBO III', which integrates inspection technology into conventional soldering equipment, significantly reducing soldering defects and achieving process improvements. At this exhibition, we will also display and demonstrate soldering machines and inspection equipment equipped with new methods, and we sincerely look forward to your visit. 【Event Overview】 ■ Date: January 21 (Wed) - 23 (Fri), 2026, 10:00 - 17:00 ■ Venue: Tokyo Big Sight ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai Tenjijo Station (about a 7-minute walk) - Yurikamome, Tokyo Big Sight Station (about a 3-minute walk) ■ Our Booth: East Hall 4 E4-2 *For more details, please download the PDF or feel free to contact us.
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【Exhibited Products】 ■ Selective Soldering Machine "Soldering Machine SELBO III-350V" (Reference Exhibit) ■ Compact Visual Inspection Machine "SE100" + Collaborative Robot ■ Desktop Selective Soldering Machine "ULTIMA-TRZ II" ■ Desktop Selective Spray Machine "ULTIMA-SPZ II" ■ All-in-One Soldering Machine "ULTIMA-NEO-L316" ■ High-Speed 3D Compatible Model of PCB Visual Inspection Machine "RV-2-3DH" ■ Solder Paste Dispenser "SD-3325" ■ Micro Defect Visual Inspection Machine (Reference Exhibit) *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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