A case of developing a bonding method that bends a film sensor into a U-shape!
We would like to introduce a VA/VE case study on "U-shaped bending adhesion" that our company conducted. There was a challenge where the film sensor could not fit within the product size. To accommodate the sensor in the limited space of the capacitive touch panel, bending was necessary, but there was a risk of damage due to the bending. We explored and realized a processing method to avoid the risks of damage from bending and the generation of bubbles caused by joining the bent surfaces. 【Case Overview】 ■Challenge: The film sensor could not fit within the product size. ■Effect: The sensor could be installed within the limited space. *For more details, please refer to the related links or feel free to contact us.
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Our company has its own factories in Thailand, Indonesia, the Philippines, and the Czech Republic, and sales offices in the United States. We integrate our domestic sales system with our overseas network to provide one-stop solutions from design to prototyping, mass production, and delivery. We can handle everything in-house, including molds, pressing, injection molding, decoration, circuit board assembly, and final assembly. This enables us to achieve high quality, short delivery times, and optimal costs in manufacturing. As an EMS partner, we strongly support our customers' businesses.
