Punching processing technology for semiconductor, AI DC, and automotive devices.
We are a manufacturer based in Higashi-Osaka, celebrating 50 years in business, specializing in precision punching processing of substrates and electronic devices. Our representative product is responsible for all 100 million nationwide transportation IC cards, with zero market complaints, possessing the technology of "zero out of 100 million." In recent years, we have been mass-producing 3 million heat dissipation components per month for power semiconductors, while also engaging in new technology development through five selections for the subsidy program. We will introduce our processing and construction techniques, which received great acclaim at last year's Silicon Valley exhibition.
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Our company was established with the aim of contributing to the promotion of industrial development in Nagoya, the core of the Chubu region, by providing comprehensive support to small and medium-sized enterprises through the promotion and dissemination of industrial technology research and development, the training of personnel related to industry, management support, and the promotion of economic exchanges, as well as by enhancing local industries, including manufacturing, and fostering the creation and development of new industries to improve citizen welfare. We will effectively and efficiently provide comprehensive support that small and medium-sized enterprises in this region require, including startup and management support, research and development support, industrial technology support, management and operation of industrial promotion facilities, and the hosting of industrial exhibitions and trade fairs.