Contract processing of SOI wafers supports wafer sizes from 3 inches to 12 inches!
At D&X Corporation, we can process silicon wafers with film deposition from 2 inches (50mm) to 12 inches (300mm). We support various deposition methods including P-CVD, LP-CVD, thermal oxidation films, sputtering, and resist for wafers ranging from 2 inches to 12 inches. Contract processing for SOI wafers is available for wafers from 3 inches to 12 inches. Please feel free to contact us when you need our services. 【Features】 ■ Small lots starting from 10 pieces ■ For in-stock items, starting from 1 piece *For more details, please download the PDF or feel free to contact us.
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.