D&X
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D&X Company Profile
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.
Business Activities
1. Dicing tape; BG (back grinding) tape; dicing tape; protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: polished wafer (PW), annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.
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Detailed information
| Company name | D&X |
|---|---|
| number of employees | 60 |
| Contact address | postalcode 190-1232 Tokyo/ Mizuho-cho, Nishitama-gun/ 1-1-4 NagaokaView on map TEL：042-527-2227 FAX：042-527-2228 |
| Industry | Electronic Components and Semiconductors |
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