With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
D&X Corporation was founded on April 8, 2008, with its headquarters in Tokyo, and has branches in Shanghai, Taiwan, and Germany. Our business activities include research and development, production, and sales of semiconductor Si wafers and semiconductor tapes. We also provide processing services such as film deposition on semiconductor Si wafers, dicing, and back grinding. 【Business Activities】 ■ Sales of semiconductor consumables *For more details, please refer to the PDF document or feel free to contact us.*
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【Products and Services】 ■Bare Si Wafer ■Back Grinding Tape ■Dicing Tape *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.