D&X Product Lineup

At D&X Corporation, we can process silicon wafers with film deposition from 2 inches (50mm) to 12 inches (300mm). We support various deposition methods including P-CVD, LP-CVD, thermal oxidation films, sputtering, and resist for wafers ranging from 2 inches to 12 inches. Contract processing for SOI wafers is available for wafers from 3 inches to 12 inches. Please feel free to contact us when you need our services. 【Features】 ■ Small lots starting from 10 pieces ■ For in-stock items, starting from 1 piece *For more details, please download the PDF or feel free to contact us.

• Processing Contract

D&X Corporation was founded on April 8, 2008, with its headquarters in Tokyo, and has branches in Shanghai, Taiwan, and Germany. Our business activities include research and development, production, and sales of semiconductor Si wafers and semiconductor tapes. We also provide processing services such as film deposition on semiconductor Si wafers, dicing, and back grinding. 【Business Activities】 ■ Sales of semiconductor consumables *For more details, please refer to the PDF document or feel free to contact us.*

• Wafer
• Other semiconductors

D&X Corporation handles "Dicing Tape." We offer UV-type dicing process tape that allows for tape release during die bonding, enhancing pick-up performance due to the reduction of adhesive strength caused by ultraviolet exposure. We also accommodate specification changes and the development of new types according to your requests. We can handle small-scale prototypes, so please inquire for more information. 【Features】 ■ Uniform elongation and high expandability ■ Reduced chipping ■ Strong adhesive strength ■ Suppression of whisker generation ■ High heat resistance *For more details, please refer to the PDF document or feel free to contact us.

• Non-ferrous metals
• Wafer processing/polishing equipment
• others

D&X Corporation offers "Back Grind Tape." We provide two types of protective tapes for the back grind process: a UV type that allows tape removal without stressing the wafer due to reduced adhesive strength from UV exposure, and a Non-UV type with low adhesion for gentle removal. We also accommodate specification changes and the development of new types based on your requests. We can handle prototypes starting from small quantities, so please contact us for inquiries. 【Features】 ■ High adhesion that prevents water ingress ■ No adhesive residue, preventing contamination of the substrate ■ High flatness for grinding processes ■ Conforms to uneven surfaces *For more details, please refer to the PDF document or feel free to contact us.

• Non-ferrous metals
• Wafer processing/polishing equipment
• others

D&X Corporation handles "Bare Wafers." We offer grades of Prime (high flatness, specified resistance values, specified edge shapes, specified thickness, etc.) wafers, Low particle wafers, recycled wafers, and coin roll wafers. Additionally, we can accommodate specifications according to your requests, such as Low haze, presence or absence of laser marks (code specification available), dopants, crystal orientation, notches (oriflap), surface conditions, and metal contamination. 【Product Overview】 ■ Supported sizes: Diameter 50–450mm ■ Handling manufacturers: SEH, SUMCO, Global Wafers, Siltronic, SK Siltron, and others ■ Special wafers: SOI, epi, glass, quartz, compound wafers, etc. ■ Supported grades: - Prime wafers, Low particle wafers, recycled wafers, coin roll wafers *For more details, please refer to the PDF document or feel free to contact us.

• Non-ferrous metals
• Wafer processing/polishing equipment
• others