Capable of grinding processing and wafer inspection! Developed to meet new tape and customer requirements.
D&X mainly deals with consumables for semiconductors. We are capable of handling processes such as film formation, size down processing, regeneration processing, polishing, and wafer inspection. Our product lineup includes semiconductor-related tapes, wafers, UV lamps, and industrial machinery. We aim to develop new tapes tailored to our customers' needs and continuously conduct tape testing and research. 【Business Overview】 ■ Planning and sales of semiconductor consumables *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Products Handled】 ■ Semiconductor-related tapes ■ Wafers ■ Ingots ■ Cases for semiconductors ■ UV lamps ■ Industrial machinery *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.