Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!
D&X Corporation handles "Dicing Tape." We offer UV-type dicing process tape that allows for tape release during die bonding, enhancing pick-up performance due to the reduction of adhesive strength caused by ultraviolet exposure. We also accommodate specification changes and the development of new types according to your requests. We can handle small-scale prototypes, so please inquire for more information. 【Features】 ■ Uniform elongation and high expandability ■ Reduced chipping ■ Strong adhesive strength ■ Suppression of whisker generation ■ High heat resistance *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Response Elements】 ■Electrostatic Dissipation ■High Transparency ■High Stretchability *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.