Hybrid implementation service of COB and SMD | Achieving miniaturization and high functionality
Are you having trouble with COB and SMD on separate lines? Optimize costs and processes with consolidated mixed loading! *One-stop support from prototypes.
Are you having trouble with mixed COB and SMD mounting? Our company offers hybrid technology that allows for high-precision mounting of COB (Chip On Board) and SMD (Surface Mount Devices) on the same substrate. In module products that are becoming smaller and more functional, we simultaneously achieve space-saving, high reliability, and thermal design compatibility. We have a proven track record in various industries, including LED modules, sensors, and medical and automotive devices. We can provide one-stop support from design and prototyping to mass production. Please feel free to consult with us! 【Features】 ■ Comprehensive support for COB + SMD mixed mounting ■ Suitable for compact, high-density circuit design ■ Many achievements in LED, sensor, and automotive modules ■ Prototypes and short delivery times are acceptable 【Use Cases and Expected Applications】 ■ Development of compact, high-output LED modules ■ Spatial optimization design on IoT sensor boards ■ Ultra-compact mounting for medical probes and wearable devices *For more details, please refer to the PDF document or feel free to contact us.
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【Other Contract Development Services】 ■ Procurement of substrates (LTCC/FPC rigid-flex/metal substrates/Si substrates/interposers) ■ Support for modularization through SMT mixed mounting, as well as MEMS and optical devices ■ Wafer processing ■ BGA package reballing and rework ■ Conducting environmental tests such as PCT and TCT in a consolidated manner to verify reliability 【Case Studies for Problem Solving】 ■ Want to use FC but can only obtain chips individually → Bump formation on individual pieces using a bump bonder ■ Implementing in overseas factories but yield is not improving → Reassessing conditions within our company. Reproducing NG and pointing out areas for review *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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![[Data] High-Density Mounting Specifications](https://image.mono.ipros.com/public/catalog/image/01/b0e/786570/IPROS29961909267008707911.jpeg?w=120&h=170)
![[Case Study] COB High-Density Packaging](https://image.mono.ipros.com/public/catalog/image/01/508/405549/IPROS42415345949277545615.jpeg?w=120&h=170)
Company information
This is a company that handles contract manufacturing and sales of image monitoring systems, electronic devices, and system in package located in Okaya City, Nagano Prefecture.
![Special substrate mounting service [Case introduction]](https://image.mono.ipros.com/public/product/image/3e1/2000231254/IPROS14918090455193285755.png?w=280&h=280)
