What is soldering? Introducing the steps and methods! Proven results in various fields! Leave the design, development, manufacturing of printed circuit boards, and control system construction to Nippo!
"Soldering" refers to the process of joining metal materials using solder without melting the base material, by allowing a lower melting point alloy (solder) to flow into the joint. The quality of soldering affects the failure and lifespan of electronic devices, so it is not an exaggeration to say that it is supported by soldering technology. For soldering printed circuit boards, two main methods are used: "wave soldering" and "reflow soldering." <Soldering Methods> - Wave Soldering: This method involves passing a circuit board on a conveyor belt over a solder pot filled with pre-melted solder, which is then sprayed onto the board for soldering. - Reflow Soldering: In this method, solder (in paste form) is pre-applied to the soldering points, and then re-melted using heat sources such as infrared, hot air, hot plates, or lasers for soldering. In recent years, automation of soldering has advanced, and "automatic soldering machines" are being utilized. Nippo has its own equipment, such as automatic component insertion machines and chip mounters, and is enhancing its manufacturing capabilities to accommodate the miniaturization and high density of electronic components. Please feel free to contact us.
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Nippo Corporation engages in a wide range of development, including the production of printed circuit boards and the construction of IoT cloud systems. We respond to customer needs with diverse technologies and equipment, including embedded software development, hardware development, and mechanical design (mechanical, sheet metal, and enclosures). We have over 60 years of extensive know-how and development achievements cultivated in many fields. We will support you with our technical expertise and proposal capabilities tailored to your requirements, so please feel free to contact us.
