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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Part "Blade Holder"

Part "Blade Holder"

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last updated:Jul 02, 2025

吉岡精工
吉岡精工
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Flange for dicing saw "Blade Holder"

This is a component used in the dicing saw of semiconductor manufacturing processes, which holds a thin blade for cutting silicon wafers. It is commonly referred to as a titanium flange or hub mount. The spindle of the dicing saw is designed for high-speed rotation, so the blade holder is made from lightweight and high-rigidity titanium alloy.

    Wafer processing/polishing equipmentcutterDiamond cutter
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Part "Blade Holder"

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  • Related Link - https://www.yoshioka.co.jp/products/bladeholder/

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basic information

【Mirror Surface Processing】 - By making the inner surface mirror-like, the adhesion to the spindle shaft is improved. - Vibration of the blade during high-speed rotation is reduced. 【Flat Surface Processing】 - Maintaining high flatness firmly holds the blade and hub. - Titanium alloy is processed with ultra-precision at the micron level. 【True Circle Processing / Burr-Free Processing】 - Minimizing imbalance reduces chipping during high-speed cutting. - Thorough dimensional control is implemented even at the screw engagement area.

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Applications/Examples of results

【Examples of Use】 〇 Semiconductor manufacturing equipment 〇 Precision grinding machines In addition, applying ultra-precision technology to medical components has achieved cost reduction through grinding-free processes.

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吉岡精工

吉岡精工

Machine elements and parts

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