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  6. PB6800 SiC KGD die handler

PB6800 SiC KGD die handler

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last updated:Nov 18, 2025

Semi Next 本社、三重事業所
Semi Next 本社、三重事業所
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Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.

The Semight PB6800 is a high-end SiC KGD die handler widely adopted in the semiconductor industry. It is specialized for dynamic and static parameter testing at the bare die level of SiC power chips, achieving high-reliability KGD (Known Good Die) sorting. This system employs a modular design and supports various die supply methods, including frame rings, tape & reel, and trays. Additionally, it allows for hard docking connections and testing at multiple stations at both room temperature and high temperature, and it is equipped with high-voltage arc protection features. It is a solution that significantly contributes to improving testing efficiency and yield in the mass production process of SiC power devices.

    Tester
PB6800.png

PB6800 SiC KGD die handler

PB6800.png
PB6800.png
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▶ Excellent Scalability Modular design allows for loading/unloading and multiple test stations, enabling flexible configurations. ▶ Dynamic/Static/UIS Test Support Supports static testing: 2000V/600A, dynamic testing: 1200V/2000A. ▶ Unloading Module Design Accommodates various unloading formats such as wafers, tape & reel, and automatic trays. ▶ High-Precision Temperature Control Controls temperature from room temperature to 200℃, achieving ±3℃ accuracy and 0.1℃ resolution. ▶ Sealed Socket Design Integrates nitrogen gas protection and pressure monitoring to prevent arc generation. ▶ High-Efficiency Multi-Site Testing Simultaneous testing at up to 6 sites, test time of 0.7 seconds, with a throughput of over 4000 UPH. ▶ High Maintainability Automatic socket replacement function minimizes downtime during bond die generation.

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Evaluation and implementation are already underway with top-class companies in the industry, and they are actively adopting our solutions.

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KGD Test Equipment Series

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Semi Next 本社、三重事業所

Electronic Components and Semiconductors

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We are a global supplier of advanced testing and measurement equipment. We provide high-performance and highly integrated measurement solutions that can support everything from research and development to mass production processes in cutting-edge fields such as high-speed communication, optical chips, electronic measurement, and power semiconductors. Since our founding, we have placed "Dedication and Craftsmanship" at the core of our corporate values, pursuing product development that combines deep insights into measurement principles with a spirit of craftsmanship. Aiming to be "the best testing solution company supporting global technological innovation," we will continue to provide high-performance, high-efficiency, and highly reliable solutions to address global industrial challenges.

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