Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.
We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.
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Our company specializes in circuit board design. With skilled circuit designers handling the design, we believe you will experience a high level of satisfaction in terms of performance and quality. Unlike typical circuit board design companies, we: 1. Have a deep understanding of circuits and digital circuits 2. Can visualize current flow 3. Thoroughly scrutinize device datasheets during the design process Our motto is to conduct designs without rework, contributing to our customers in terms of performance, quality, and delivery time! Additionally, as a fabless manufacturer, we propose the most suitable manufacturing methods tailored to our customers' specifications, costs, and deadlines. We handle FPGA development, power systems, motors, wireless, firmware, and software, allowing us to undertake comprehensive system development projects. We are also happy to accommodate small quantities, such as prototypes and component development products.
![Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]](https://image.mono.ipros.com/public/product/image/462/2000445848/IPROS03776884707830630519.jpeg?w=280&h=280)
