[Case Study] Hot Plate Unit

Achieving temperature uniformity within 0.2℃ with the adoption of mica heaters!

We would like to introduce a case study where a semiconductor manufacturing equipment manufacturer, which handles cleaning devices, coating and developing devices, thermal processing devices, and other auxiliary and special processing equipment for semiconductor manufacturing front-end processes, implemented a "mica heater" in their hot plate unit. The company required minimizing the temperature difference on the wafer on the hot plate to the utmost limit. In conventional heating methods, slight temperature variations could lead to a decrease in product yield, and improving uniformity was a challenge. After implementation, in a 150°C operating environment, the temperature distribution on the wafer achieved a range of 0.2°C or less. This represents an extremely high level of uniformity in the industry, significantly enhancing stability and reproducibility in the manufacturing process. 【Case Overview】 ■ Background: A heating solution with excellent uniformity was required to eliminate temperature variations. ■ Solution: A mica heater with excellent uniformity and heat resistance was adopted, and optimization was carried out from the pattern design. ■ Effect: Achieved a temperature distribution range of 0.2°C or less, improving process safety and the overall reliability of the equipment. *For more details, please download the PDF or feel free to contact us.

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