It can be used for mobile phones and portable gaming devices! It has moderate rebound force from low compression.
We would like to introduce the "SM-T Series" of SM contacts that we handle. It features a structure that prevents unexpected spring breakage and provides adequate rebound force even at low compression. Additionally, due to its small size, it can be used in mobile phones and small gaming devices. The gold flash enhances solder wetting properties, allowing for stable conductivity at the contact points. 【Features】 ■ Structure that prevents unexpected spring breakage ■ Adequate rebound force even at low compression ■ Small size allows for use in mobile phones and small gaming devices ■ Gold flash enhances solder wetting properties, enabling stable conductivity at contact points *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Material - Stainless steel t=0.08mm (Base plating: Ni plating all over / Contact surface: solder surface or all over: gold flash) - Titanium copper t=0.1mm (Base plating: Ni plating all over / Contact surface: solder surface or all over: gold flash) ■Recommended elastic usage range (2 types): 0.9mm to 1.2mm, 2.1mm to 2.6mm *For more details, please download the PDF or feel free to contact us.
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Takeuchi Industries pursues high performance and high quality in the electronics field, responding to a wide range of customer needs. We also accommodate special products, so please feel free to contact us.