[Semiconductor Free Webinar] Five Expectations for the Advanced Packaging Market in 2026
Introducing the challenges of heat in 3D stacking and chiplet integration in mobile devices!
Our company held a free webinar on semiconductor-related topics titled "Five Expectations for the Advanced Packaging Market in 2026." We analyzed the advanced packaging market for 2026, covering topics such as the adoption of co-packaged optics, HBM demand from AI, the transition to panel and glass substrates, thermal challenges in 3D stacking, and chiplet integration in mobile devices. 【Event Overview】 ■ Date and Time: December 3, 2025, at 10:00 AM (Japan Time) ■ Duration: 1 hour *For more details, please download the PDF or feel free to contact us.
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