Regarding the outer casing, we can implement thermal measures and check for electromechanical interference in collaboration with our business partner!
Our company is engaged in the "Printed Circuit Board and Enclosure Design" business. The core team members have many years of experience in the field, allowing us to respond broadly from high-density, high-layer-count boards used in server equipment to advanced information terminal boards and boards integrated into smart glasses. Regarding enclosures, we can conduct thermal management and electromechanical interference checks in collaboration with our partner companies. 【Main Tools】 ■ First Corporation START ■ Zuken Corporation Design Force ■ Cadence Allegro ■ Mentor, a Siemens Business PADS *For more details, please refer to the related links or feel free to contact us.
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Our company is committed to reducing costs, shortening lead times, and enhancing design capabilities on a daily basis. - Reduction of design costs and shortening of design periods through our wholly-owned subsidiary in China. - Lowering the cost of simulation services through collaboration with local simulation specialists in China. - Promotion of circuit board design using the de facto standard CAD for North American users and data compatibility with domestic CAD. - Procurement of electronic components from East Asia, including North America and China, which are difficult to obtain in Japan. We accept orders starting from just one component. - A wide range of CAD/CAM and simulation data input/output services. We have realized these initiatives while responding to our customers' requests. We are here to assist in advancing pending projects and those requiring improvement. We are happy to take on any process.
![[Development Case] Enclosure Design Embedded Systems](https://image.mono.ipros.com/public/product/image/49c/2000460991/IPROS82399171071451579834.png?w=280&h=280)
