Free distribution of technical materials on thin film circuit board technology that supports high performance!
In the semiconductor industry, with the advancement of device performance, there is a demand for miniaturization, high density, and high thermal conductivity of substrates. In particular, high-frequency characteristics and thermal management are crucial factors that influence device performance. Inadequate substrates can lead to signal degradation and failures due to overheating. Our thin-film circuit substrates utilize film deposition technology and thin-film processing technology to address these challenges. 【Application Scenarios】 - Laser Diode (LD) mounting substrates - Light Emitting Diode (LED) mounting substrates - Photodiode (PD) mounting substrates 【Benefits of Implementation】 - High-density mounting through the formation of high-precision fine circuit patterns - Extended device lifespan due to excellent thermal conductivity - Improved design flexibility through patterning on three-dimensional surfaces and thick-film copper plating support
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【Features】 - Formation of thin film electrodes, resistive films, and solder films on ceramic substrates and others - High-precision fine circuit pattern formation - Patterning support for three-dimensional surfaces - Thick film Cu plating support - Standard substrate materials: AlN, AlN/Cu, SiC 【Our Strengths】 Citizen Fine Devices leverages the technology cultivated over many years in the field of functional components that require compact precision, high accuracy, and high detail to provide high value-added microdevice products. Based on the metal processing technology developed in watch manufacturing, we have established a consistent production system from process design to processing, assembly, and functional testing. By integrating mass production technology for brittle materials, material technology, ultra-precision processing technology, thin film technology, and bonding technology, we create high-quality functional device products.
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The area where Citizen Fine Devices demonstrates its strength is in the realm of functional components that require small size, precision, high accuracy, and high detail. We believe that our mission is to continue providing high-value-added microdevice products by leveraging the unique technologies we have developed over many years. Utilizing metal processing technology rooted in watch manufacturing, we have consistently supplied small, high-precision components to our customers for many years through a fully integrated production line that encompasses process design, machining, assembly, and functional testing, along with the unique development of our own processing machines. Additionally, mass-producing components with high precision and efficiency using brittle materials is also one of our core technologies. By integrating material technology with ultra-precision machining, thin-film technology, and bonding technology, we produce not only high-precision components such as ceramics and quartz but also high-quality functional device products like liquid crystal devices and sensing devices. Continuing to provide high-value-added products to the market is a significant dream for our employees. We will contribute to the creation of new value through manufacturing driven by the challenge spirit of each individual, working towards the realization of that dream.
![[Circuit Board Manufacturing Example] Thin Film Circuit Board](https://image.mono.ipros.com/public/product/image/7b4/2000570851/IPROS60687999797142408463.png?w=280&h=280)
