Improving the classification efficiency of fine particles with an ultrasonic powder sifter for chemistry.
Artec ultrasonic sieve DGS 35kHz, ultrasonic hopper FS 35kHz (FlowSonic)
Solve the challenges of powder screening processes! Improve clogging, adhesion, and agglomeration to achieve higher yields and reduced time.
In the chemical industry, the precise classification of fine particles affects product quality and efficiency. Particularly when uniformity of particle size distribution is required, issues such as sieve clogging, particle adhesion, and agglomeration can reduce classification efficiency and impair productivity. Our ultrasonic powder sieving machine addresses these challenges and optimizes the classification process for fine particles. 【Application Scenarios】 - Manufacturing processes for pharmaceuticals, cosmetics, inks, pigments, etc. - Sample preparation of fine particles in research and development - Particle size measurement in quality control 【Benefits of Implementation】 - Reduces clogging and adhesion, improving sieving efficiency - Achieves higher yield and time savings - Enables the production of products with uniform particle size distribution
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basic information
【Features】 - Achieves dry sieving with high mesh sizes such as 20μm openings - Compatible with standard JIS mesh frames from Φ75 to Φ400 using a clamp-type fixture for easy one-touch installation - Measures to prevent surface adhesion, bridging, and rat-holing with an ultrasonic hopper, improving discharge capability - Removal of foreign substances and deagglomeration through ultrasonic sieving at the hopper discharge, resulting in fluffy powder advantageous for transport in the next process - Quantitative supply transport through ultrasonic vibration allows for integrated management with electronic scales 【Our Strengths】 UC Technology has been a leader in ultrasonic technology since 1966, providing optimal solutions tailored to our customers' challenges. We support our customers' fine particle classification processes with a wide range of support, including experimental assistance, demo equipment loans, and consulting.
Price information
The rental evaluation of the demo unit is usually provided free of charge for two days. Please consult us for evaluations of demo units lasting more than one week. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for mesh clogging caused by powder adhesion and handling measures in powder transport environments. It has been adopted in various raw material developments to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products and more *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year's Powder Industry Exhibition will be held in Osaka. We look forward to seeing everyone there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Industry Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
