Efficient powder screening with an ultrasonic powder sifter for battery materials!
Artec Ultrasonic Sifter DGS 35kHz, Ultrasonic Hopper FS 35kHz (Flowsonic)
Solving the challenges of powder screening processes! Achieving increased yield and reduced time!
In the battery materials industry, the quality of materials and production efficiency are crucial. Particularly in the powder material screening process, issues such as clogging, adhesion, and agglomeration can lead to a decline in quality and stagnation in productivity. There is a demand to resolve these issues and establish an efficient production system. Our ultrasonic powder screener addresses these challenges and contributes to improving your production efficiency. 【Application Scenarios】 - Powder screening in the manufacturing process of battery materials - Classification of fine particles using high-mesh screening - Quality improvement through foreign matter removal - Powder supply in hoppers and shooters 【Benefits of Implementation】 - Suppression of clogging, adhesion, and agglomeration - Reduction of screening time - Improvement in yield - Stabilization of product quality
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basic information
【Features】 - Achieves dry sieving with high mesh sizes such as 20μm opening - One-touch installation compatible with clamp-type fixtures for standard JIS mesh frames from Φ75 to Φ400 - Measures against surface adhesion, bridging, rat-holing, and improved discharge capacity using ultrasonic hoppers - Removal of foreign substances and disintegration through ultrasonic sieving at the hopper discharge outlet - Quantitative supply transport with ultrasonic vibration allows for integrated management with electronic scales 【Our Strengths】 UC Technology has been contributing to solving challenges across various industries since 1966, based on ultrasonic technology. Drawing on years of experience and achievements, we provide optimal solutions tailored to our customers' needs. We also offer robust support systems, including experimental support, demo equipment loans, and ultrasonic consulting.
Price information
The rental evaluation of the demo unit is usually provided free of charge for two days. For evaluations of demo units lasting more than a week, please consult with us. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for countermeasures against mesh clogging caused by powder adhesion and handling issues in powder transport environments. It has a proven track record from various raw material developments to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products and more *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year, the Powder Technology Exhibition will be held in Osaka. We look forward to seeing you all there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Technology Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
