Ultra-fine tungsten core diamond wire (for semiconductor production)

basic information

Physical properties of W) Abbreviations: D = Diamond, W = Tungsten, Re = Rhenium, Ni = Nickel, (S) = Sample available - Specific gravity Sp: 19.3 g/cm³ (almost the same as gold) - Melting point: 3380°C (the highest among metals) - Mohs hardness: 7.5 - Boiling point: 5555°C - Thermal conductivity: 160 W/m·K (at 300 K) ● Strength) Tensile fracture strength: - D25: 3N approximately 300 gf - D30: 4N approximately 400 gf - D35: 5N approximately 500 gf - D40: 7N approximately 700 gf ◎ Comparison of physical properties with high carbon steel core wire) - Electrical resistivity: about half that of carbon steel - Fracture strength: over 1.2 times - Torsional rigidity: over 10 times - Young's modulus: 1.7 times - Elongation ratio: about 60% Chemical properties of W and D) ◎ W material: Tungsten W 99.4% + Rhenium Re 0.6% Alloy symbol: WRe 0.6 ● Reaction with O2: Oxidation begins or graphitization occurs for both W and D at 400 to 700°C (oxidation prevention and cooling measures are necessary) ○ Hazardous materials: No ○ Toxicity: None ○ D line quality standard: ASTM not yet available

Price information

(Price for a roll of 100 km length) - W25: 350,000 yen - W30: 390,000 yen - W35: 430,000 yen - W40: 500,000 yen Includes shipping and tax; customs duties are separate; terms are negotiable.

Price range

P3

Delivery Time

P4

Applications/Examples of results

Diamond Multi-Wire Saw ◎ Explanation of Electrical Resistivity: The diamond wire saw → fixes diamond powder around the core wire using electroplating or coating → the electrical resistivity of tungsten is about half that of carbon steel → the current capacity is about twice as much → from the diamond powder dispersed plating solution → a thick (diamond-holding nickel) electroplated layer can be formed on the outer diameter surface. ◎ Process of Fixing Diamond Powder: The Ni layer on the outer circumference of the tungsten wire is ferromagnetic, so → it is immersed in a type of flowing dispersion of diamond powder in nickel plating solution → forming a diamond powder electroplating + Ni plating layer → followed by a heat-fixing treatment. ◎ Measures for Oxidation Prevention and Cooling: - Oxidation Prevention: PSA Molecular Sieve Nitrogen Gas Generator (S) - Air Cooling: Spin Chamber Cold/Hot Separation Compressed Air Pipe (S) - Water Cooling: Peltier Element Cold/Hot Separation Semiconductor (S) Cautions for Use: Tungsten ultra-fine wire has a mysterious property that allows it to easily curl just by rubbing it with fingers → curling can cause kinks → while curling can be visually corrected by lightly heating with a flame, the strength of the corrected area will definitely decrease → therefore, curls that form at the ends should be cut off → care should be taken not to form curls in the middle section → if you need to bend the wire path, always use a wire path roller to avoid resistance.

Detailed information

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  Diamond wire structure

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  Diamond wire saw operating principle

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  Multi-wire slicing of silicon ingots using a diamond multi-wire saw.

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  Slurry cutting and wire saw cutting

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  Diamond Wire Saw Image Analysis Device

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  100km roll of wire

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