High performance enhancement of thin film circuit boards for semiconductors.
Thin film circuit boards support the high performance of semiconductors.
In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products
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**Features** - High-precision fine circuit pattern formation - Excellent thermal conductivity (AlN: 170~230 W/m·K, SiC: ~370 W/m·K) - Support for patterning on three-dimensional surfaces - Support for thick film Cu plating - Compatibility with various substrate materials **Our Strengths** Citizen Fine Devices leverages the technology cultivated over many years in the field of functional components that require compact precision, high accuracy, and high detail to provide products tailored to customer needs. With a consistent production line from process design to machining, assembly, and functional testing, we ensure a stable supply of high-quality products.
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The area where Citizen Fine Devices demonstrates its strength is in the realm of functional components that require small size, precision, high accuracy, and high detail. We believe that our mission is to continue providing high-value-added microdevice products by leveraging the unique technologies we have developed over many years. Utilizing metal processing technology rooted in watch manufacturing, we have consistently supplied small, high-precision components to our customers for many years through a fully integrated production line that encompasses process design, machining, assembly, and functional testing, along with the unique development of our own processing machines. Additionally, mass-producing components with high precision and efficiency using brittle materials is also one of our core technologies. By integrating material technology with ultra-precision machining, thin-film technology, and bonding technology, we produce not only high-precision components such as ceramics and quartz but also high-quality functional device products like liquid crystal devices and sensing devices. Continuing to provide high-value-added products to the market is a significant dream for our employees. We will contribute to the creation of new value through manufacturing driven by the challenge spirit of each individual, working towards the realization of that dream.
![[Circuit Board Manufacturing Example] Thin Film Circuit Board](https://image.mono.ipros.com/public/product/image/7b4/2000570851/IPROS60687999797142408463.png?w=280&h=280)
