Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.

Semiconductor implementation technology that achieves a 70GHz bandwidth. Completion of a complex 24-step process through collaboration among 15 companies.

We have developed a three-layer coplanar RDL substrate using low-loss insulating materials and simultaneously achieved high-precision bonding of millimeter-wave chips. We overcame technical challenges such as wrinkles and warping due to thermal expansion, as well as deposits during via processing, through thorough process improvements. By utilizing landless vias and three-layer impedance matching RDL, we ensured transmission characteristics over a wide bandwidth of 70 GHz. This is a top-tier example of realizing customer desires by managing 24 complex processes through the amoeba-like collaboration of 15 partner companies. *For detailed information on the millimeter-wave compatible implementation process and verification results, please refer to the downloadable materials.*

Contract manufacturing