McDermid solder-based thermal conductive materials
STIM McDermid KESTER
McDermid solder-based thermal interface material sTIM solves thermal issues in high-performance power semiconductors.
sTIM (Solder Thermal Interface Material) is a non-adhesive, non-organic solder-based thermal interface material. It achieves high thermal conductivity for high-performance power semiconductor applications, which are approaching the limits of conventional organic TIMs, supporting next-generation thermal management. MacDermid Alpha is a global supplier in the semiconductor packaging field and has a track record of receiving the Intel SCQI Award in the thermal interface materials sector.
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basic information
◆Very high thermal conductivity due to metal/solder type ◆High reliability due to the absence of organic materials ◆Ideal for high power and high heat generating devices
Price range
Delivery Time
Applications/Examples of results
◆Thermal interface material between the die (chip) and the heat spreader ◆Thermal interface material between the heat spreader and the heat sink
Detailed information
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Using STIM as an adhesive between the heat sink.
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General usage instructions
Company information
The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.
![[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)](https://image.mono.ipros.com/public/product/image/08c/2001440591/IPROS40565002714052496557.jpeg?w=280&h=280)
