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  6. Impulse backplane connector

Impulse backplane connector

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last updated:Mar 26, 2026

レスター 本社
レスター 本社
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Equipped with 101 pairs of high-density modular interfaces per square inch!

The "Impulse Backplane Connector" is a connector system that provides high-speed, scalable, modular solutions for cable, traditional, and orthogonal board-to-board connections with a maximum speed of 112G. It improves airflow, enhances signal integrity, and is suitable for supporting cable backplane and cable midplane solutions for data center architecture. By using low-loss biaxial cables, it reduces insertion loss and eliminates the need for power-hungry retimers. The innovative cantilever signal beam interface also accommodates resonances in interfaces well beyond 35GHz. 【Features】 ■ Achieves 112Gbps PAM-4 data rates ■ High-density design maximizes PCB space ■ Cable solutions with low-loss biaxial cables ■ Orthogonal solutions support 90-degree and 270-degree orientations ■ Error-free mating supported by integrated guide pins ■ Scalability through a modular connector system *For more details, please feel free to contact us.

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Impulseバックプレーンコネクタ1.png

Impulse backplane connector

Impulseバックプレーンコネクタ1.png
Impulseバックプレーンコネクタ1.png Impulseバックプレーンコネクタ2.png Impulseバックプレーンコネクタ3.png Impulseバックプレーンコネクタ4.png Impulseバックプレーンコネクタ5.png
  • Related Link - https://www.restargp.com/
  • Special site - Product/service details - https://pr.mono.ipros.com/restar-ele/product/

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basic information

【Specifications】 ■Signal Speed: 56G NRZ/112Gbps (PAM-4) ■Density: 101 pairs per square inch ■Impedance: 90 Ohm ■Pair-to-Pair Spacing: 4.00mm ■Row-to-Row Spacing: 2.00mm *For more details, please feel free to contact us.

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Applications/Examples of results

【Industry-Specific Applications】 ■Network ■Data storage devices, modular switches, routers, servers ■Server & Storage ■Rack servers *For more details, please feel free to contact us.

News about this product(1)

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

  • Seminar・Event

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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レスター

レスター 本社

Electronic Components and Semiconductors

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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.

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