The rapid increase in data center power due to the expansion of generative AI. A practical overview of the transition from air cooling to liquid cooling, cold aisle containment, water-cooled INRow, and immersion cooling.
■Title: Heat Dissipation/Cooling Technology for AI Data Centers ■Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM ■Target Audience for the Seminar Electronic equipment designers (assembly design, mechanical design, circuit design, board design), heat dissipation device/material developers, quality assurance, and quality control departments ■Knowledge Gained from the Seminar - Basic knowledge of heat transfer - Heat dissipation knowledge in component and board design - Common thermal design techniques for forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc.
Inquire About This Product
basic information
■Event Details Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM Participation Fee: 55,000 yen (tax included) * Includes materials * Our newsletter members (registration is free) 49,500 yen (tax included) Method of Attendance: This seminar will be a live-streamed seminar using "Zoom."
Price information
Participation fee: 55,000 yen (tax included) *Includes materials *For our newsletter members (registration is free): 49,500 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
Delivery Time
Applications/Examples of results
For details about the program and how to apply, please check the related link URL.
Company information
We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
