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  6. Latest Trends in High-Speed Connectivity, High Current, and Heat Dissipation Technologies for the Data Center Market

Latest Trends in High-Speed Connectivity, High Current, and Heat Dissipation Technologies for the Data Center Market

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last updated:Mar 30, 2026

レスター 本社
レスター 本社
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A comparative explanation of technological evolution and the latest solutions. A free webinar hosted by Molex introducing advanced technologies for the rapidly expanding data center market.

We would like to introduce advanced technologies for the rapidly expanding data center market in a webinar hosted by Molex. ■ Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers In this webinar, we will provide a clear explanation while comparing the evolution of technology and the latest solutions, including: - High-speed connection technologies supporting 112Gbps/224Gbps - High-density mezzanine connections for AI-oriented GPUs - Power connections for high current applications and heat dissipation products. This content will serve as hints for product selection and problem-solving for those involved in the design and development of data center equipment. We encourage you to participate in this opportunity. 【Event Overview】 ■ Date: April 22, 2026 (Wednesday) 15:00 - 16:00 ■ Format: Zoom Webinar ■ Cost: Free (Pre-registration required) ■ Registration Deadline: April 21, 2026 (Tuesday) by 12:00 *For more details, please refer to the related links or feel free to contact us. A catalog of the lineup products is also available for download.

    Other ConnectorsWiring materialsSeminar
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Latest Trends in High-Speed Connectivity, High Current, and Heat Dissipation Technologies for the Data Center Market

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**Lecture Content (Excerpt)** ■ Internal Wiring "BiPass" Technology - Introduction to the "BiPass" technology, an internal wiring solution that supports high-speed signal transmission. ■ Mezzanine Connector Connection for SoC (ASIC) Boards - Explanation of high-density mezzanine connection solutions for AI/high-performance computing applications. ■ Power Connection Technology in OCP ORV3 Rack - Introduction to rack-level power connection technology that supports high current. ■ Heat Sinks and Liquid Cooling Products for Optical Modules *For more details, please refer to the related links or feel free to contact us. Catalogs of our product lineup are also available for download.*

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【Product Information】NextStream Connector System / High-Speed PCIe Board Interconnection & Cables

【Product Information】NextStream Connector System / High-Speed PCIe Board Interconnection & Cables

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Product Information: Impel & Impel Plus Custom Backplane Cable Assembly

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【Product Information】CX2, CX2 Dual-Speed Connector & Cable Assembly

【Product Information】CX2, CX2 Dual-Speed Connector & Cable Assembly

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Product Information: BiPass I/O High-Speed Solution

Product Information: BiPass I/O High-Speed Solution

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NearStack PCIe Connector System and Cable Jumper Assemblies

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Impel Plus Backplane Solutions

Impel Plus Backplane Solutions

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Impel Plus Backplane Solutions【Product Diagram】

Impel Plus Backplane Solutions【Product Diagram】

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Impel Backplane Products

Impel Backplane Products

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

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"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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レスター

レスター 本社

Electronic Components and Semiconductors

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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.

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