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  6. Component analysis of the tape adhesive layer

Component analysis of the tape adhesive layer

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last updated:Mar 30, 2026

アイテス
アイテス
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Introducing analytical methods widely used for component analysis of polymer materials!

We would like to introduce the "Component Analysis of Tape Adhesive Layers" that we conduct. EGA (Evolved Gas Analysis) is an analytical method that obtains the mass spectrum of gases generated while heating the sample. Thermal Desorption GC-MS is a method that separates and analyzes the components that have decomposed and gasified due to the heating of the sample. Both methods are widely used analytical techniques for component analysis of polymer materials. [Examples of GC-MS Analysis Applications] ■ Analysis of impurities and additives contained in polymer materials such as films and rubber ■ It is also possible to analyze outgassing by connecting to a headspace autosampler *For more details, please download the PDF or feel free to contact us.

    Other Analysis
EGA

Component analysis of the tape adhesive layer

EGA thermogram_mean MS spectrum.png
EGA thermogram_mean MS spectrum.png
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Component analysis of the tape adhesive layer

Component analysis of the tape adhesive layer

TECHNICAL
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[Data] Analysis of PTP packaging sheets by EGA-MS analysis and thermal desorption/pyrolysis GC-MS analysis.

[Data] Analysis of PTP packaging sheets by EGA-MS analysis and thermal desorption/pyrolysis GC-MS analysis.

OTHER
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Quantitative analysis of low molecular weight siloxanes

Quantitative analysis of low molecular weight siloxanes

PRODUCT
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[Information] GC-MS Analysis Device Guide

[Information] GC-MS Analysis Device Guide

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Analysis of mica sheet adhesive components using GC/MS.

Analysis of mica sheet adhesive components using GC/MS.

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Component analysis of organic matter (FT-IR and GC/MS)

Component analysis of organic matter (FT-IR and GC/MS)

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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