Polygonal mirror finish wire cutting process for semiconductor masks

High-precision mirror finishing of complex shapes of semiconductor masks using wire cutting.

In the semiconductor industry, high precision and surface quality are required for mask fine processing. In particular, masks with complex shapes such as polygons may be difficult to handle with polishing processes. Inappropriate processing can lead to reduced yield and performance degradation of the products. Our wire-cut processing not only achieves mirror finishing on the outer surfaces of polygons but also on the inner surfaces, ensuring high precision in processing. With years of experience and know-how, we achieve beautiful processed surfaces without adding a polishing step, leading to process reduction and cost benefits. [Application Scenarios] - Manufacturing of semiconductor masks - Precision machining of complex-shaped components [Effects of Implementation] - Improved product quality through high-precision mirror finishing - Cost benefits from process reduction - Enhanced capability to handle complex shapes

Processing Contract