Tohoku Univ. Technology：Temperature sensing and vibration detection method：T25-060
Wiring-free miniature temperature sensor
Conventional thermal property measurements using thermistors and thermocouples require electrical wiring, which limits further improvements in sensor density and sensitivity. Resonant temperature sensors using in-plane mechanical resonators also suffer from low areal density, and laser-based readout becomes impractical when many sensing points are required. To overcome these limitations, the inventors developed a wiring-free temperature sensor that optically detects the resonance vibration amplitude of a high–aspect ratio micro-resonator. This architecture is well suited to dense array integration and achieves a temperature sensitivity of 32%/°C, exceeding that of frequency-shift-based resonant sensors (35 ppm/°C) and thermistors (2.0%/°C), making it promising for high-sensitivity temperature measurement.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
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