Ultra-thin IC cooler | Compatible with 1U, FPGA, and CPU
JCC, JSC Series - JARO Thermal
Ultra-thin IC cooler (fan-equipped heat sink) that meets thermal management needs for high-density packaging.
This is an ultra-thin IC cooler (fan-equipped heat sink) designed to address heat dissipation measures in high-density implementation environments. It combines high heat dissipation performance through a cold-forged pin fin structure with space-saving design due to its integrated fan, achieving efficient cooling even in limited enclosure spaces. The JCC series uses aluminum and copper materials, featuring a low-profile design with dimensions of 51mm to 70mm square and a height of 13mm, making it suitable for cooling 1U servers, communication equipment, CPUs, FPGAs, and chipsets. The JSC series responds to further space-saving and safety needs with its ultra-thin structure of 10.7mm in height and models with fan guards. It allows for optimal model selection based on application, heat generation, and installation space, contributing to thermal management across a wide range of fields, including industrial PCs and embedded devices.
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basic information
■JCC Series Material: Aluminum (AL 1050 / 1060 / 1070 / 6063), Copper (CU1100) Size: L51.0–70.0 × W51.0–70.0 × H13.0 mm Structure: Cold forged pin fin heat sink + integrated fan structure Surface treatment: Anodizing / Anti-oxidation treatment ■JSC Series Material: Aluminum Size: L45.0 × W45.0 × H10.7 mm Structure: Ultra-thin integrated IC cooler (fan embedded structure, models with fan guard available) ■Common Specifications Applicable Uses: CPU, FPGA, Chipset, SoC, Network Equipment, Industrial PC, Embedded Devices Features: Ultra-thin design, High-density mounting support, Low-profile structure, Local cooling support
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Applications/Examples of results
This product is an ultra-thin IC cooler (fan-equipped heat sink) suitable for heat dissipation applications in high-density mounting environments. It is primarily used for cooling medium to small-sized high-heat-generating devices such as CPUs, FPGAs, SoCs, chipsets, and network processors. It is particularly effective in chassis designs with strict height restrictions and space constraints, such as 1U rack-mounted servers, communication equipment, industrial PCs (IPCs), and embedded devices. Additionally, it supports localized cooling of heat-generating components on PCI Express cards and high-density mounted circuit boards, contributing to the suppression of temperature rises in VRMs and peripheral circuits. It achieves efficient heat dissipation in limited spaces, contributing to the stable operation and long-term reliability of equipment.
Company information
Our company has celebrated its 70th anniversary as a paper trading company. In addition to paper, we also handle packaging materials based on flexible packaging. We have also focused on the sale of LED lighting and have started selling several original products. We offer not only standard LED lighting but also high color rendering LED lighting, LED base lighting for hospitals, and high ceiling LED lighting that can be used in harsh environments such as factories and warehouses. In recent years, we became the first distributor in Japan for ICWUSA, an American monitor arm manufacturer. Known for its robust construction designed for professional use, it stands out in terms of originality compared to other products. We have actual units on display in our showroom on the first floor of our headquarters. We invite you to visit us and experience them firsthand.
