Equipped with a unique resist processing method to accommodate 0.5-inch wafers!
Our company participates in the Minimal Fab Technology Research Association and is engaged in the development of minimal resist coaters and developers. Minimal Fab is an innovative system that combines flexible versatility, ultra-low cost, and high reliability, making it usable worldwide. For research and development, prototyping, and small-batch production, it can be scaled down in terms of equipment size and investment amount to match the required production volume and objectives. 【Minimal Coater/Developer Specifications】 ■ Substrate: 0.5-inch wafer ■ Substrate transport ・Minimal shuttle & transport system PLAD ・No cleanroom required due to proprietary local cleaning technology ■ Equipment size: 294mm(W) × 450mm(D) × 1,440mm(H) *For more details, please refer to the related links or feel free to contact us.
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Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
