The heat generation of AI servers has entered an era exceeding 1 kW. A systematic explanation from heat transfer fundamentals to TIM selection, GPU cooling structures, and PUE considerations.
■ Title: "Heat Dissipation/Cooling Technologies for AI Data Centers" ―― The rapid increase in data center power due to the expansion of generative AI. How to address PUE targets and high-heat GPUs. A practical overview from air cooling to liquid cooling, cold aisle containment, water-cooled INRow, and immersion cooling. A strategic course to master thermal issues. ■ Date and Time: June 2, 2026 (Tuesday) 10:30 AM – 4:30 PM ■ Zoom Streaming (Missed archive available with materials) 【Knowledge Gained from the Seminar】 - Basic knowledge of heat transfer - Heat dissipation knowledge in component and PCB design - Common thermal design methods for forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc. 【Target Audience for the Seminar】 Electronic device designers (assembly design, mechanical design, circuit design, PCB design), heat dissipation device/material developers, quality assurance, and quality control departments.
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■Event Details Date and Time: June 2, 2026 (Tuesday) 10:30 AM - 4:30 PM Zoom streaming + on-demand archive available (with materials)
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Tuition Fees - General: 55,000 yen (tax included) - Newsletter Members: 49,500 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
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We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
