Heat distortion can be predicted. Design issues can be prevented through simulation.
★★Shirutoku Report: Useful Information You Should Know★★ One of the challenges that cannot be overlooked in electronic components and circuit board design is deformation due to heat. This time, we will discuss thermal warping caused by temperature changes in multilayer structures with different materials in each layer.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![[Data] Shirutoku Report 117 #Heat Warping Caused by Temperature Changes](https://image.mono.ipros.com/public/catalog/image/386624/IPROS10356122456133165043.jpeg?w=120&h=170)
Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
![Amenities Meter: Creating a Comfortable Working Space with IoT [Work Style Reform]](https://image.mono.ipros.com/public/product/image/6fb/2001027009/IPROS12754886358639934309.png?w=280&h=280)
