Laminator for the electrical and electronic field
This is a device for laminating various electric/electronic materials into base materials (in roll, sheet, and temporary forms). Features: - Laminates the target using a pressure roller under various conditions - The arrangement of heating and pressure rolls can be customized - Pressure range: 0 to 10 kg (compatible with air cylinders, weights, and various hydraulic options) - Heating temperature: room temperature to MAX 200℃ Additionally, thanks to our extensive experience in FA/CIM support, we can simultaneously build upstream/downstream supply transport, loaders/unloaders, etc. We contribute to your labor-saving and significant improvements in production efficiency.
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basic information
This is a device for laminating various electric/electronic materials into base materials (in roll shape, sheet shape, and various temporary forms). Features: - Laminates the target using a pressure roller under various conditions - The arrangement of heating and pressurizing rolls can be customized - Pressing force: 0 to 10 kg (compatible with air cylinders, weights, and various hydraulic options) - Heating temperature: room temperature to MAX 200°C Additionally, leveraging our extensive experience in FA/CIM support, we can simultaneously build upstream/downstream supply transport, loaders/unloaders, etc. This will contribute to your company's labor-saving and significant improvements in production efficiency.
Price information
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Delivery Time
Applications/Examples of results
Copper foil, bonding of FCP
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.