The AL-300 model performs half-cutting of various functional films into arbitrary shapes using a laser, while leaving the release paper intact, for wafer bonding and wafer applications.
If you have any questions regarding the explanation below, please feel free to contact us.
Inquire About This Product
basic information
The AL-300 model is a device that automatically applies various functional films to wafers, such as wafer bonding, wafer dry film, and wafer solder resist, by half-cutting them into any shape with a laser while leaving the release paper intact. The AL-300 model utilizes MCK's unique technology, which was patented in 2001. For other functions and details, please contact us. (Contact: Kawaguchi)
Price information
-
Delivery Time
P4
Applications/Examples of results
The AL-300 model performs half-cutting of various functional films into arbitrary shapes using a laser while leaving the release paper intact, and automatically applies them to wafers for bonding, wafer dry film, wafer solder resist, and more.
catalog（2）
Download All Catalogs
Company information
The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.
![[TOLAMI Original Laminator for Construction Sites]](https://image.mono.ipros.com/public/product/image/2071381/IPROS7451353973516285575.jpg?w=280&h=280)
