The AL-300 model performs half-cutting of various functional films into arbitrary shapes using a laser, while leaving the release paper intact, for wafer bonding and wafer applications.
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basic information
The AL-300 model is a device that automatically applies various functional films to wafers, such as wafer bonding, wafer dry film, and wafer solder resist, by half-cutting them into any shape with a laser while leaving the release paper intact. The AL-300 model utilizes MCK's unique technology, which was patented in 2001. For other functions and details, please contact us. (Contact: Kawaguchi)
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Delivery Time
P4
Applications/Examples of results
The AL-300 model performs half-cutting of various functional films into arbitrary shapes using a laser while leaving the release paper intact, and automatically applies them to wafers for bonding, wafer dry film, wafer solder resist, and more.
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The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.
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