IC appearance inspection device
The CSP/BGA/WLCSP solder bumps are inspected quickly and accurately. It is equipped with a revolutionary image processing device that differs from conventional methods. The difference is more pronounced with smaller bump diameters and narrower pitches compared to conventional machines. The PVI-500 is a standalone unit with a single tray supply type, suitable for small lot inspections. The inspection unit can accommodate both 2D and 3D capabilities.
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basic information
The CSP/BGA/WLCSP solder bumps are inspected quickly and accurately. It is equipped with a revolutionary image processing device that differs from conventional methods. The difference is more pronounced with smaller bump diameters and narrower pitches compared to conventional machines. The PVI-500 is a standalone unit with a single tray supply type, suitable for small lot inspections. The inspection unit can accommodate both 2D and 3D capabilities.
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Applications/Examples of results
This is a visual inspection device for finished CSP/BGA/WLCSP that has been put into practical use since August 2004.
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.
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