Device for removing organic substances attached to wafers.
A device aimed at removing organic substances attached to wafers, focusing on NG (non-good) products generated in the manufacturing process, to protect against confidential information leakage and reduce the costs of wafer reuse and regeneration. 【Features】 ◆ Protection against confidential information leakage during waste disposal and commissioned regeneration. ◆ Reduction of organic substance removal costs during commissioned regeneration. ◆ Reduction of spare parts costs through the reuse of test wafers. ◆ Reduction of manufacturing costs through the reuse of undamaged wafers. *For more details, please contact us for information requests.
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basic information
A device aimed at removing organic substances attached to wafers, focusing on NG (non-good) products generated in the manufacturing process, to protect against confidential information leakage and reduce the costs of wafer reuse and regeneration. 【Features】 ◆ Protection against confidential information leakage during waste disposal and commissioned regeneration. ◆ Reduction of organic substance removal costs during commissioned regeneration. ◆ Reduction of spare parts costs through the reuse of test wafers. ◆ Reduction of manufacturing costs through the reuse of undamaged wafers. *For more details, please contact us for materials.
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Applications/Examples of results
[Usage] It is used in the fields of solar cells, LEDs, and integrated circuit manufacturing.
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Company information
We design, manufacture, and sell various types of equipment for both testing and research purposes as well as production automatic devices, including various front-end (photoresist-related) devices and manual spin coaters (for Si, LCD glass, compounds, etc.). [Testing and Research Development, Production Related Equipment for Semiconductors and LCDs] Various cleaning machines (wet, dry), spin coaters, mask aligners, developing and etching equipment, various vacuum devices, probers, and drillers for film thickness measurement, etc.