Bump formation
We can accommodate various specifications and uses. Additionally, we can handle various substrate materials such as glass, silicon wafers, and films. Not only can we perform bump processing, but we also support processing of wiring patterns and more, so please feel free to consult with us.
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basic information
Bump formation is an essential process for various mounting technologies such as CSP, BGA, and flip chip. Our company can accommodate various bump processing from just one piece, tailored to your specifications and budget. - Stud Method (for chips only) Au stud bumps: Available in two wire diameters: 18μm and 25μm (you can choose based on bump height and diameter). We can also support 2-layer and 3-layer bump processing. - Plating Method Electroplating: Au, Ni, Cu, Ag, Pt, etc. Various solders (eutectic, high melting point) Lead-free solder (Sn-Ag, Au-Sn) (We can also accommodate various electroless plating options.) The substrates can be made of glass, Si (silicon), film, etc. Application examples: TEG for IC mounting evaluation, membrane substrates, cantilevers, probe inspection substrates, etc.
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Applications/Examples of results
TEG for IC implementation evaluation Membrane substrate Cantilever Probe inspection substrate Additionally, it can be useful in fields such as equipment development and material development.
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.