4-inch wafer compatible nano coater (release agent application device)
This device is designed to apply a release agent, rinse clean, and dry the agent on a work surface by processing a maximum 4-inch wafer substrate. The treatment is performed one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI.
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basic information
【Main Specifications】 1. Stroke: 140mm 2. Target Size: 4 inch 3. Target Material: Wafer 4. Dip Speed: From 0.1mm/sec to 10mm/sec 5. Coating Liquid Circulation: None 6. Coating Liquid Temperature Control: None 7. Filter Mesh: None 8. Drying Section: None 9. Drying Temperature: None 10. HEPA Unit: None 11. Device Size (Approximate): W:450×D:670×H:685mm
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Delivery Time
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Applications/Examples of results
Application of release agent to 4-inch wafer substrate
Line up（3）
| Model number | overview |
|---|---|
| NIC-1109G | |
| NIC-0809 | |
| NIC-1103 |
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