Support yield improvement through pressure management!
◆ We provide sensor sheets according to the size of the silicon wafer. ◆ We support both batch and single-sheet processing. ◆ The sensor sheets are ultra-thin, with a thickness of approximately 0.1mm, allowing measurements in conditions very close to actual use. ◆ Measurement data can be displayed in 2D and 3D screens. Additionally, the captured data can be replayed, and the analysis functions are comprehensive (please contact us for compatible computer models).
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basic information
◆ We prepare sensor sheets according to the size of the silicon wafer. ◆ We support both batch and individual leaf types. ◆ The sensor sheets are ultra-thin, with a thickness of about 0.1mm, allowing measurements in conditions very close to actual use. ◆ Measurement data can be displayed in 2D and 3D screens. Additionally, the captured data can be replayed, and the analysis functions are well-equipped (please contact us for compatible computer models).
Price information
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Delivery Time
※45 days
Applications/Examples of results
◆Silicon wafer polishing contact pressure distribution ◆CMP
Company information
In today's world, where advanced technological capabilities are required of all Japanese companies, we aim to be a trading company that not only embodies "integrity" and "technology," but also explores our customers' needs and responds to their requests, rather than being just a simple trading company.