Precision Bonding Device (Semi-Automatic)
This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. However, we have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.
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basic information
This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. We have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.
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Applications/Examples of results
LCD panels, touch panels
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Company information
We have been designing and manufacturing precision machinery and automation equipment tailored to individual needs. Rather than simply automating manual tasks, we delve into the processes themselves to propose new manufacturing systems (methods). That is our solution.
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