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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Semiconductor inspection/test equipment
  6. Wafer Edge Profile Measurement Device

Wafer Edge Profile Measurement Device

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EPM-300

last updated:Mar 14, 2008

大倉インダストリー
大倉インダストリー
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Conventional high-speed measurement capability about 10 times faster! It is possible to capture the shape of the edge in just a few seconds!

The wafer edge profile measurement device EPM-300 is equipped with a uniquely developed laser microscope that measures edge shapes with sub-micron accuracy. When combined with processes like CMP, it allows for the overlay and verification of edge shapes before and after polishing. It features a high-speed measurement function that captures profiles at approximately ten times the speed of conventional methods, enabling edge shape acquisition in just a few seconds. Additionally, it includes functions for roundness measurement, notch alignment, notch shape measurement, and image acquisition, with an option for measuring the cross-sectional shape of notches. Furthermore, in addition to 200mm and 300mm wafers, edge shape measurement for 450mm wafers is also available as an option, allowing for rapid verification of upcoming sample products.

    Semiconductor inspection/test equipmentWafer processing/polishing equipmentImage analysis software
装置外観写真3.jpg

Wafer Edge Profile Measurement Device

装置外観写真3.jpg
装置外観写真3.jpg

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basic information

The wafer edge profile measurement device EPM-300 is equipped with a uniquely developed laser microscope, allowing for edge shape measurement with sub-micron precision. When combined with processes like CMP, it enables the overlay and verification of edge shapes before and after polishing. It features a high-speed measurement function that acquires profiles at approximately ten times the speed of conventional methods, allowing for edge shape acquisition in just a few seconds. Additionally, it includes functions for roundness measurement, notch alignment, notch shape measurement, and image acquisition, with an optional feature for measuring the cross-sectional shape of notches. Furthermore, in addition to 200mm and 300mm wafers, edge shape measurement for 450mm wafers is also available as an option, enabling rapid verification of upcoming sample products.

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300mm wafer edge inspection Inspection of wafer polishing condition

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大倉インダストリー

大倉インダストリー

Testing, Analysis and Measurement

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At Okura Industry Co., Ltd., in addition to wafer edge profile measurement devices, we design, manufacture, and sell optical and mechatronic equipment such as laser microscopes. We can provide custom solutions for automatic inspection devices and observation evaluation devices that utilize microscopes, flexibly accommodating optimal wavelengths, fields of view, inspection methods, and software for inspections.

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The related categories of Semiconductor inspection/test equipment

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Semiconductor inspection/test equipment
  • Wafer processing/polishing equipment
  • Image Processing
  • Image analysis software
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