A material in which the polymer components of the sheet soften due to heat and adhere closely to the substrate, resulting in reduced thermal resistance and excellent heat dissipation effects.
The product is softer compared to our conventional products, making it easy to adhere to the substrate and excellent in reworkability. Additionally, during installation, it compresses thinly even under low pressure, allowing it to demonstrate excellent heat dissipation effects even on uneven heating surfaces.
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basic information
【Features】 ○ Step absorption between elements of different heights ○ Does not flow even at high temperatures (pump-out resistant) ○ Good transfer workability ● For more details, please contact us or download the catalog.
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Applications/Examples of results
The product is suitable for heat dissipation of various semiconductor devices such as computer CPUs, driver ICs for flat panel displays, and automotive ECUs. It is particularly recommended for devices with stepped structures or warping, as it excels in pump-out resistance characteristics and long-term reliability.
Company information
Vinyl chloride resin, silicone, and cellulose derivatives are essential materials for daily life and industry, and are also used in environmentally friendly products. Additionally, we handle many semiconductor and electronic-related materials such as semiconductor silicon, synthetic quartz, rare earth magnets, and photoresists, supporting cutting-edge technology as a super supplier of high-tech materials.
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