The ease of use is appealing.
This is a newly developed outer diameter grinding machine designed with the shaping of sapphire substrate ingots in mind. It features high-efficiency processing based on the "cylindrical three-dimensional grinding method" and user-friendly aspects such as hydraulic work clamping. It is designed with end-face reference centering in mind, which strengthens the workpiece axis compared to conventional machines. It also demonstrates its capabilities in processing semiconductors like silicon carbide and various ceramics. By adding the OF processing option, it can perform both outer diameter and OF processing with a single machine.
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basic information
【Features】 - The workpiece is clamped by hydraulic pressure and processed by a grinding wheel that is perpendicular to the work rotation axis and offset by the grinding wheel's rotation radius. - A specially structured grinding wheel shaft is used, allowing the grinding wheel to rotate in reverse to match the direction of travel. - Settings for the cutting depth per traverse, finishing dimensions, and cutting amount just before finishing are configured, enabling automatic processing. - The left and right limit position settings are easily done using a teaching method. - For other functions and details, please contact us.
Price information
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Applications/Examples of results
【Purpose】 〇Metal processing ●For other functions and details, please contact us.
Company information
We mainly manufacture and sell grinding machines and cleaning machines. We also create crafts using carbon dioxide lasers, so please take a look at those as well.
