It is a compact tabletop device that is easy to operate yet capable of high-precision processing.
The tabletop precision vertical grinding device NVG-200A is a compact and easy-to-operate machine that enables high-precision processing. It allows for easy management of flatness, parallelism, and dimensions. Depending on the selection of grinding wheels, it can process difficult-to-cut materials, including ceramics. The device offers both automatic and manual modes based on the method of detecting grinding amounts. For more details, please contact us or refer to the catalog.
Inquire About This Product
basic information
【Specifications】 [Grinding Method] ○Sample Axis: Fixed in the vertical direction ○Grinding Wheel Section: Descending grinding method, automatic (grinding amount setting) or manual grinding [Sample Section] ○Sample Mounting Method: Vacuum chuck or center bolt fixation ○Sample Size: Maximum diameter φ107mm, thickness 40mm or less ○Sample Axis Rotation Speed: 0–300rpm ○Sample Surface Position Reading →Linear gauge counter (automatic grinding) →Or dial gauge (manual grinding) →Minimum reading value 1μm ○Grinding Fluid Supply: Circulating water flow (linked pump) [Grinding Wheel Section] ○Grinding Wheel Holding Method: Pneumatic balance ○Grinding Wheel Size: Outer diameter φ90mm ○Grinding Wheel Rotation Speed: 0–600rpm ○Grinding Wheel Descending Speed: Automatic grinding descent 10–25μm/min ○Sample Holding Function: Grinding wheel axis current detection temporary descent stop mechanism [Device Dimensions] ○Main Body: 450×675×900mmH, Weight: 50kg ○Control Unit: 340×300×270mmH, Weight: 15kg ○Grinding Fluid Pump: 250×400×500mmH, Weight: 20kg ○Power Supply: AC100V, single phase, 6A, 50/60Hz ○Air Compressor: 5kg/cm² ●For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or refer to the catalog.
catalog（1）
Download All Catalogs
Company information
In the development of new materials such as semiconductors, organic synthesis materials, optical materials, various ceramics, and electronic materials from conventional general materials, the observation of the fine structural organization of the materials is essential, and optical microscopy is conducted. To achieve this, sample preparation that faithfully represents the structural organization as much as possible is required. Our lapping/polishing technology aims to contribute to production that allows for sample polishing capable of observing fine details more faithfully than conventional methods, as well as high-precision mass production. The materials in the world are diverse and varied, each possessing unique characteristics, and to process them efficiently and easily, it is necessary to find the optimal process suited to each from a wide variety of factors. In other words, it is the "Know-How" of the processing process. If you are considering polishing for anything from small to large items, please feel free to contact us, including mechanical and C.M.P. We are committed to providing the best possible methods.
![Deburring Machine "Twin Baritor" [Eligible for Small and Medium Enterprise Productivity Investment Subsidy]](https://image.mono.ipros.com/public/product/image/6d3/2000308654/IPROS16685940644635288329.png?w=280&h=280)
