We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!
Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!
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basic information
The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and forming wiring and vias repeatedly for each layer. By using build-up boards, there are several advantages: ● Smaller board size In through-hole boards, it is necessary to create TH (holes that serve as electrical pathways) to connect the layers, which increases the board area due to the holes. In build-up boards, there are no through holes on the surface layer, allowing for a larger component placement area. ● Strong against noise Build-up boards are not only smaller, but their structure also results in thinner interlayer thickness. Therefore, they actually have strong noise resistance characteristics. ● Capable of carrying large currents For devices that use large currents, build-up boards may be more suitable. One reason is that they only place the minimum necessary vias, allowing for more copper foil to be used. ● High design flexibility The freedom of pattern wiring is high, enabling high-density component placement and wiring that was difficult with through-hole boards.
Price information
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Delivery Time
※Kyoden with short delivery times. Build-up substrate manufacturing is possible in as little as 2 days! Please feel free to contact us.
Applications/Examples of results
Printed circuit board component mounting
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Company information
Kyouden Co., Ltd. is a comprehensive manufacturer of printed circuit boards. In addition to printed circuit boards, we provide comprehensive manufacturing support for all processes involved in manufacturing. By owning all processes in-house, we have established a unique "fully in-house convenience factory" that is not found in other EMS manufacturers. We manufacture build-up boards, high-layer count boards, and through-hole boards with high quality and short delivery times, providing full support from prototyping to mass production. We utilize cutting-edge technology to accommodate 5G communication, high-frequency, high-density, and high-heat dissipation boards. Feel free to let us know if you only want to use part of a process or if you want to use processes from this step to that step. Our strength lies in our ability to respond flexibly from any process. Please make use of Kyouden as a convenient factory for your needs!
![[Free Materials Available!] Can't Ask Now! Build-Up Substrate](https://image.mono.ipros.com/public/product/image/a6e/2001132939/IPROS65914902931229555175.png?w=280&h=280)
